Microsoft's hardware teams incubate advanced technologies and build deep partnerships with internal research, product planning, and marketing teams. Microsoft ships tens of millions of hardware products every year, including the Xbox, Surface devices, HoloLens, accessories, and much more. Our opportunities represent a variety of disciplines including, but not limited to, design, verification, and performance modeling, and DevOps supporting the development of custom silicon. Microsoft's hardware teams are also expanding into new technologies such as quantum computing! We are looking for the best and brightest to join us in designing for the future!

Responsibilities

Microsoft Silicon Operations Team is part of the Silicon Development Organization that develops novel solutions in custom CMOS devices for use in Microsoft’s product platforms; XBox, HoloLens, Surface and Azure.  The Package Engineering function provides support, expertise and insight to the Si device development team through the entire life cycle of the product. The Thermal Engineer position involves diverse responsibilities supporting the design and implementation of new custom Si devices. Responsibilities will include power distribution/thermal modelling of custom silicon devices, both thermal and mechanical modelling of new packaging technology, design and development thermal test vehicles, and development of thermal solutions for ATE test systems.

The Senior Engineer position requires experience in the Fabless semiconductor model with a working knowledge of package technology and manufacturing. Successful candidates will have an understanding of a variety of IC package technologies, with specific experience modelling and/or testing thermal performance duction to manufacturing of advanced semiconductor package technology. Candidate should possess specific experience in one or more of the following areas: thermal modelling, thermal testing, and mechanical finite element modelling. In addition, experience with a variety of thermal constructions/materials is preferred.

Qualifications

• Bachelor’s degree in Materials Engineering, Mechanical Engineering, or other semiconductor packaging related discipline
• Minimum 8+ years of experience in IC package modelling/design/development
• Hands on proficiency with thermal and mechanical modelling software

Preferred Qualifications

• Master’s degree in Mechanical or Thermal Engineering
• 10+ years experience in IC package development
• Experience in developing and characterizing thermal test vehicles

Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include, but are not limited to, the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud background check upon hire/transfer and every two years thereafter.

Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, color, family or medical care leave, gender identity or expression, genetic information, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran status, race, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable laws, regulations and ordinances. We also consider qualified applicants regardless of criminal histories, consistent with legal requirements. If you need assistance and/or a reasonable accommodation due to a disability during the application or the recruiting process, please send a request via the Accommodation request form.

Benefits/perks listed below may vary depending on the nature of your employment with Microsoft and the country where you work.